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 년도별 목차보기 |
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| 발행년도/권호 |
2016 년 / 권호: V.28,no.1,Mar |
| 논문제목1(원어) |
열전도성 입자를 활용한 시트용 점착제의 점착 특성과 방열특성 연구 |
| 논문제목2(타언어) |
Comparative Analysis of Heat Sink and Adhesion Properties of Thermal Conductive Particles for Sheet Adhesive |
| 저자(원어) |
김영수·박상하1·최정우1·공이성1·윤관한1·민병길1·이승한2,* |
| 저자(타언어) |
Yeong Su Kim, Sang Ha Park1, Jeong Woo Choi1, Lee Seong Kong1, Gwan Han Yun1, Byung Gil Min1 and Seung Han Lee2,* |
| 소속(원어) |
금오공과대학교소재디자인공학과, 금오공과대학교 에너지화학공학과, KIT융합기술원 |
| 소속(타언어) |
Kumoh National Institute of Technology, kit |
| 시작/끝
페이지 |
48 ~ 56 총페이지 : |
| 언어(원어) |
Korean |
| 초록 |
Abstract Improvement of heat sink technology related to the continuous implementation
performance and extension of device-life in circumstance of easy heating and more
compact space has been becoming more important issue as multi-functional integration
and miniaturization trend of electronic gadgets and products has been generalized. In
this study, it purposed to minimize of decline of the heat diffusivity by gluing polymer
through compounding of inorganic particles which have thermal conductive properties.
We used NH-9300 as base resin and used inorganic fillers such as silicon carbide(SiC),
aluminum nitride(AlN), and boron nitride(BN) to improve heat diffusivity. After making
film which was made from 100 part of acrylic resin mixed hardener(1.0 part more or less)
with inorganic particles. The film was matured at 80℃ for 24h. Diffusivity were tested according
to sorts of particles and density of particles as well as size and structure of particle
to improve the effect of heat sink in view of morphology assessing diffusivity by LFA(Netzsch/
LFA 447 Nano Flash) and adhesion strength by UTM(Universal Testing Machine).
The correlation between diffusivity of pure inorganic particles and composite as well as
the relation between density and morphology of inorganic particles has been studied. The
study related morphology showed that globular type had superior diffusivity at low density
of 25% but on the contarary globular type was inferior to non-globular type at high density
of 80%. |
| 키워드 |
Keywords diffusivity, heat sink, thermal conductivity, adhesive, adhesion, inorganic
composite, acrylic adhesive |
| 학회지 |
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| Reference |
http://www.koreascience.or.kr/article/ArticleFullRecord.jsp?cn=OSGGBT_2016_v28n1_48&ordernum=6 |
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